Emerson and CoreTigo Join Forces to Showcase Wireless Floor to Cloud Packaging Solutions at PACK EXPO 2023
August 24, 2023 Emerson and CoreTigo are set to showcase the new era of packaging solutions with industrial wireless automation at the upcoming PACK EXPO, 2023. With CoreTigo’s IO-Link Wireless solutions, and Emerson’s revolutionary future of automation technologies, packaging machine builders and manufacturers can now achieve new enhanced capabilities and solve critical challenges for packaging…