Pilz Safety Laser Scanner PSENscan Now with ROS Package

PBUS PSEN 400

Sept 1, 2020

The safety laser scanner PSENscan offers new opportunities for the production logistics sector: thanks to the ROS (Robot Operating System) package from the Open Source Framework, PSENscan can now be used not just for safe, productive area monitoring but also for navigating automated guided vehicles (AGV).

With the help of the new ROS packages, the data you need for navigation is available in ROS-compliant format, without the need for additional programming. As a result, a SLAM algorithm(Simultaneous Localisation and Mapping) can be fed in, for example. So maps of the environment are produced for dynamic navigation and the AGV avoids obstacles, for example. You benefit from a more dynamic and therefore safe implementation of mobile applications in production environments.

ROS’s open, modular approach enables multiple safety laser scanners to be integrated simply into existing ROS environments. Applications with PSENscan can be flexibly adapted to customised tasks. Pilz ROS packages conform to the industry requirements of the ROS Industrial Consortium and are developed and tested in accordance with Pilz development standards. As a result, new software features can be implemented quickly.

Go HERE for more information

Source

Related Articles



Editor’s Pick: Featured Article

Weidmüller’s u-control 2000: The Automation Controller

Weidmüller’s u-control 2000: The Automation Controller

Weidmüller’s scalable engineering software, u-control 2000, adapts individually to your requirements. And, the u-control is powerful, compact and fully compatible with Weidmüller’s I/O system u-remote. This article looks at what makes u-control the heart of your automation.

Programmable logic controllers (PLCs) are one of the main components of any automated system. A typical control system has inputs, outputs, controllers (i.e., PLCs), and some type of human interaction with the system, a human machine interface (HMI), for example.

Read More



Latest Articles

  • Advanced X-Ray Techniques Transform BGA Inspection in Electronics Manufacturing

    October 23, 2024 Discover how X-Ray technology is transforming the inspection of Ball-Grid-Array (BGA) components, ensuring higher product quality and reliability in electronics manufacturing. In the fast-paced world of electronics, the demand for smaller, more efficient, and reliable components is ever-increasing. This has led to the widespread adoption of Ball-Grid-Array (BGA) components. However, ensuring their… Read More…

  • Purpose-Built Forged Parts Optimized for Power Generation “End Use”

    October 21, 2024 By Royce Lowe Working with an experienced supplier of open die forgings, seamless and contoured rolled rings, and complex forged parts that prioritizes the “end use” of the forged part form in the early stages of the process helps ensure quality, performance, safety, and compliance in critical applications. When forging seamless rolled… Read More…